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HOME»News center

Last Updated: 05/17/2012

Infineon and Fuji Enter Into Agreement for HybridPACK™ 2 Power Modules

[ 2012/05/17 ] Infineon Technologies  Power Supply

Molex Unveils Two New Versions in its Premo-Flex™ Line of Jumpers

[ 2012/05/17 ] Molex  Passive / Connections / mechanical parts

NXP Powers NFC in the Samsung GALAXY S III

[ 2012/05/17 ] NXP Semiconductors  Network/Telecommunication

Off-Line Primary Side Sensing Controller with PFC

[ 2012/05/16 ] Texas Instruments  LED

ADI ADXR453: High Performance, Digital Output Gyroscope

[ 2012/05/15 ] Analog Devices  Analog

1 nV/√Hz Low Noise 210°C Instrumentation Amplifier

[ 2012/05/15 ] Analog Devices  Analog

TDK-EPC Corporation - Inductors: SMT version with highest reliability

[ 2012/05/14 ] TDK  Passive / Connections / mechanical parts

Osram: Highest Power for Industrial Lasers

[ 2012/05/11 ] Osram Opto semiconductors  LED

SolarSpec™ Panel-Mount DC Connectors and Terminals from

[ 2012/05/11 ] Molex  Passive / Connections / mechanical parts

Bourns Releases Two New White Papers

[ 2012/05/11 ] Bourns  Equipment and control components