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Winbond

Product Line

Introduction of Main Products
DRAM

Mobile DRAM

Winbond mobile DRAM devices support both x16 and x32 data widths.
Major features for the families of products shown in the table
below include the following: Sequential or Interleave burst、
High Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、
Automatic Temperature Compensated Self Refresh Rate(ATCSR)、
Deep Power-Down (DPD)、and Programmable output buffer driver strength.
Please refer to the datasheets for specific features.
Pseudo SRAM
LowPower SDR SDRAM
LowPower DDR SDRAM
LowPower DDR2 SDRAM

Specialty DRAM

Specialty DRAM, focusing on low and middle density,
features characteristics of high performance and high speed
and is widely used by leaders in the consumer, communication,
computer peripheral, industrial, and automobile markets
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
SDR SDRAM

FLASH

Serial NAND Flash

These products are an extension of the Serial NOR Flash products
at higher densities. To simplify the life of designers looking to
store code on their systems at densities beyond the NOR Flash
offering of 512Mb density, Winbond is offering Serial NAND products
with the same SPI interface with a cost effective NAND based solution
at higher densities like 1Gb and 2Gb.

SLC NAND Flash

Winbond’s focus is to service the lower density code storage SLC NAND segment.
These SLC NAND Flash products are a direct drop-in replacement to the SLC NAND
products available in the industry from different suppliers at this time
and the products are fully compatible. The command set, the interface
and the packages are the same that other suppliers provide. The feature set
that Winbond offers is a superset of the features that other suppliers offer.

Serial NOR Flash

Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular
Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors
and the industry's highest performance.