| 2023/09/18 |
|
PCN(Product Change Notice)
|
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date:18-Sep-2023 (the earliest date that a customer could expect to receive changed material) |
| 2023/09/18 |
|
PCN(Product Change Notice)
|
Description Of Change: Qualification of an alternate adhesive material and molding compound for select LFCSP packages (LFCSP with non-conductive epoxy). 1. Adhesive material: Hitachi EN4300 2. Mold compound: Sumitomo G700LA.
Effectivity Date: 18-Sep-2023 |
| 2025/09/08 |
|
PCN(Product Change Notice)
|
PCN No.:PCN 25_0091 Rev. - Change Desc.:Qualification of Wafer Fabrication Site Analog Devices, Inc. Camas WA for (Bipolar) Products
Reason For Change: Leveraging the existing qualified process at our Analog Devices Camas, WA Fab ensures a reliable and continuous supply for our customers securing their needs well into the future. The affected products will be manufactured using ADI specified manufacturing flows, materials, process controls, and monitors ensuring no degradation of quality and reliability performance.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no expected impact to fit, form, function or reliability. |
| 2025/09/08 |
|
PCN(Product Change Notice)
|
PDN No.: PCN 25_0091 Rev. A Description: Qualification of Wafer Fabrication Site Analog Devices, Inc. Camas WA for (Bipolar) Products. Updated qualification results to include 1000 hours of HTOL and 1000 hours of HTS. |