The CFP15B clip-bond FlatPower package is engineered for maximum robustness and reliability under the toughest conditions, making it ideal for automotive applications. This reliability was proven when the CFP15B passed Board Level Reliability (BLR) compliance at a leading Tier 1 automotive supplier. It was confirmed that CFP15B exceeded twice the level of reliability performance that would be expected with AEC-Q101. 

The surface-mount semiconductor package offers superior thermal performance and space-saving opportunities. Watch this 2-minute video to learn more about the versatile package design of CFP15B that is suitable for a wide range of diode technologies, but can also be extended to transistors. 

More information at https://www.nexperia.com/cfp