| 2019/11/25 |
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PCN(Product Change Notice)
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Shipping tray change for select DDR3/DDR4 DRAM Components in 96b BGA 8x14mm package |
| 2023/05/16 |
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PCN(Product Change Notice)
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DDR3 SDRAM 4Gb & 8Gb (V00H) wafer fabrication will transfer to Micron's Fab 6 site with sample availability according to listed package type and temperature grade below.
Revision History: Revision 4, 2023-05-12: This document supersedes PCN #33095 Revision 3 dated 2022-02-18. The Last Shipment date has been extended from 2023-03-31 to 2024-03-31, and is also reflected in the PCN below. |
| 2024/11/18 |
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PCN(Product Change Notice)
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Micron will be updating all packaging, DDR5 module and LPCAMM2 labels with the~new Micron logo. Any packaging, DDR5 module or LPCAMM2 labels printed after~2024-12-17 will have the new Micron logo. |
| 2025/12/17 |
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PCN(Product Change Notice)
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PCN No.:35941 Change Desc.:Test Site - Addition (proliferation) Micron is adding a Component Test site as indicated below
Current: MXA - Micron Semiconductor Xi'an Co., Ltd., Zone B of Shaanxi Xi'an Export Processing Zone, Xin Xi Avenue, Xi'an, 710119 China (PRC)
Future: MXA - Micron Semiconductor Xi'an Co., Ltd., Zone B of Shaanxi Xi'an Export Processing Zone, Xin Xi Avenue, Xi'an, 710119 China (PRC) MMP - Micron Memory Malaysia Sdn. Bhd. PMT 779, Lingkaran Cassia Selatan Taman Perindustrian Batu Kawan 14110 Bandar Cassia Penang, Malaysia.
Reason: Manufacturing Efficiency
Product Ship Date: 2025-12-17 |