Mobile Phone teardown report:23013PC75G Fomalhaut Techno Solutions Mobile telephone teardown report - 商品詳細情報
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Mobile Phone teardown report:23013PC75G
Mobile Phone teardown report:23013PC75G
Mobile telephone teardown report
Mobile telephone teardown report
Specifications
- Manufacturer name
- Fomalhaut Techno Solutions
- Product name
- Mobile Phone teardown report:23013PC75G
- Product classification
- Mobile telephone teardown report
- Model name
- 23013PC75G
- Manufacturer
- Xiaomi
- Release date
- 2023/05/09
- File size
- 7864KB
- Feature
- Snapdragon 8+ Gen 1と64MPメインカメラを搭載したゲーミングスマートフォン。
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C1S Part Number
:C1S228800009074
Stock -
| Pricing(USD) | |
|---|---|
| US$1,170 |
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Product name : Mobile Phone teardown report:23013PC75G
Manufacturers : Fomalhaut Techno Solutions
Quantity : 1
Subtotal : US$1,170.00
-
There are 0 part(s)
Total : US$
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Product name : Mobile Phone teardown report:23013PC75G
Manufacturers : Fomalhaut Techno Solutions
Quantity : 1
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