Discover Hirose’s FH79 Series, an ultra-compact automotive FPC connector with a 0.3mm pitch and a low 1.2mm profile, ideal for high-density board layouts. Engineered for extreme conditions, it withstands temperatures up to 125°C, ensuring long-term durability. The top and bottom contact enhances board flexibility, while the secure back-flip locking mechanism increases FPC retention force for stable, reliable connections. Optimized for high-speed signals, it supports eDP1.3 at 5.4Gbps and MIPI D-PHY at 4.5Gbps, making it ideal for advanced automotive applications.

• Compact and Space-Saving

Narrow Pitch: 0.3mm (Mounting Pitch: 0.6mm)

Low-Profile: 1.2mm

• 125℃ heat resistance meets stringent testing requirements for various automotive  applications.

• Top & bottom contact design enhances board design flexibility and simplifies assembly.

Introducing Hirose's FH79 Series: A compact, high-performance back-flip FPC connector featuring a 0.3mm pitch and 1.2mm low-profile design. Engineered for automotive applications, the FH79 Series ensures superior reliability, space efficiency, and heat resistance for high-density board designs.

Designed for FPC automotive electronics, where high-speed data transmission in a compact and robust connector is essential.

Stay ahead of the curve with the FH79 Series Connector. For deeper insights, visit and subscribe to our YouTube channel. Hirose Electric – Connecting the Future.

To learn more visit: https://info.hirose.com/products/fh79

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