PCN/PDN/NRND Information STM32H745XIH6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2020/09/11	PCN(Product Change Notice)	ASE Kaohsiung (Taiwan) additional source for TFBGA14x14 for STM32H75 2MB products [Old] Back-end sources: - Amkor ATP Philippines [New] Back-end sources: - Amkor ATP Philippines - ASE Kaohsiung Taiwan - Additional source
2021/01/08	PCN(Product Change Notice)	PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/05/08	PCN(Product Change Notice)	NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2022/09/22	PCN(Product Change Notice)	STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvement Timing / schedule Intended start of delivery : 2022-09-22
2023/08/28	PCN(Product Change Notice)	ASE Kaohsiung (Taiwan) - qualification of a second source substrate supplier (SCC - Shennan Circuit Company) for BGA package, size from BGA5x5 to BGA18x18, for listed products Old First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different impacted products. New First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product. Second source supplier SCC for all impacted products. Timing / schedule Intended start of delivery 2023-09-06
2024/05/21	PCN(Product Change Notice)	Description of change Old Assembly lines / wire bonding: - AMKOR (Philippines) / Gold wire - ASE Kaohsiung (Taiwan) / Gold wire New Assembly lines / wire bonding: - AMKOR (Philippines) / Gold wire - ASE Kaohsiung (Taiwan) / Gold wire - ASE Kaohsiung (Taiwan) / Copper Palladium wire - Additional Source Timing / schedule Intended start of delivery 2024-06-05
2025/02/17	PCN(Product Change Notice)	Supplier Notice No.:MDG/24/14375 Title: AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products. Description of change: Old/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function Intended start of delivery: 2025-02-17
2025/02/17	PCN(Product Change Notice)	Supplier Notice No.:MDG/24/14375#1 Title: AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products. Description of change: (Updated document) Old/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function Intended start of delivery: 2025-02-17
2025/03/28	PCN(Product Change Notice)	Description of change Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 65 - February 2025 New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 66 - April 2025 Timing / schedule Intended start of delivery 2025-04-17
2025/07/03	PCN(Product Change Notice)	PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3) old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
2025/07/18	PCN(Product Change Notice)	PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter) Timing / schedule Intended start of delivery 2025-08-18
2025/12/15	PCN(Product Change Notice)	PCN No.:EMBEDDED PROCESSING/25/15272 Change Desc.:Chinese Supply Chain, as additional source, for STM32H75x/74x products in BGA packages. Reason / motivation for change: Due to the success on the market of STM32 devices, ST Microcontrollers Division decided to qualify an additional front-end site to maintain state of the art service level to our customers thanks to extra capacity. Intended start of delivery: 2025-12-15
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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