| 2022/05/08 |
|
PCN(Product Change Notice)
|
NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2023/06/26 |
|
PCN(Product Change Notice)
|
AMKOR ATP (Philippines) CHANGE OF CARRIER TAPE SUPPLIER (Wi 16mm BGA 8x8) for TFBGA 8x8 100L products
Timing / schedule Intended start of delivery 2023-06-26 |
| 2025/02/17 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MDG/24/14375#1 Title: AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.
Description of change: (Updated document) Old/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire
New/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function
Intended start of delivery: 2025-02-17 |
| 2025/02/28 |
|
PCN(Product Change Notice)
|
ST Crolles (France) additional source for STM32G41x/G47x/G48x, STM32L43x/L44x/L4Zx and STM32L47x/L48x products in M10/90nm technology. |
| 2025/07/03 |
|
PCN(Product Change Notice)
|
PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(2/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |