| 2023/08/10 |
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PCN(Product Change Notice)
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Qualification of Alternate Wafer Fab Site at ADI Limerick for 0.6um CMOS Amplifier Product Effectivity Date: 10-Aug-2023 (the earliest date that a customer could expect to receive changed material) |
| 2024/05/06 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 23_0068 Rev. A Title: Qualification of Alternate Wafer Fab Site at ADI Limerick for 0.6um CMOS Amplifier Product
Description Of Change: 1) Analog Devices is adding Analog Devices, Limerick (ADLK) as an alternate Wafer Fab site to TSMC Fab 9, Fab 2A and Fab2B for 0.6um CMOS Amplifier products. 2) Changed wafer diameter from 6"" to 8"" for a limited number of parts, refer to table in Supporting Documents section for substrate change details.
Reason For Change: This change will ensure manufacturing agility and continuity of supply.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to fit, form, function, or reliability.
Effectivity Date: 10-May-2024 (the earliest date that a customer could expect to receive changed material) |
| 2025/10/03 |
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PCN(Product Change Notice)
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PCN No.:PCN 25_0162 Rev. - Change Desc.:Gold to Copper Wire Conversion Change of bond wire from Gold wire to Copper wire for all the parts listed, in specific subcon. BOM also updated to be compatible with Cu wire. ASECL: BOM compound G700LA and Die attach EN4900G. ATP: compound is Sumitomo G700LS and Die attach AB8290. UTAC: compound is G700LTD and Die attach AB8600. All materials have qualified and in production for ADI devices.
Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives. Note: ASE, Amkor, UTAC, all have been in Cu wire production for 10+ years and over billion units shipped to commercial and automotive customers.
Effectivity Date: 03-Oct-2025 (the earliest date that a customer could expect to receive changed material) |