| 2020/07/10 |
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PCN(Product Change Notice)
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Qualification of MMT as a new final test site for selected Atmel AT27C/BV/LVxxxPU/JUxxx products. |
| 2025/07/22 |
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PCN(Product Change Notice)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 2/9th notification. |
| 2025/09/19 |
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PCN(Product Change Notice)
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PDN No.: CENO-22NWQI834 Description: CCB 7231.018 Final Notice: Qualification of MMT as new final test site for selected AT27C040, AT27C080, AT27LV040A, AT28HC256, AT28HC256E, AT28C256, AT28BV256, AT28C256EF, AT27C010, AT28HC64BF, AT28BV64B, AT27BV256, AT27LV256A, AT28HC64B, AT27BV010, AT28C64B, AT27C256R, AT27LV010A, AT27LV020A, AT27C512R, AT27C020 and AT27LV512A device families available in 32L PLCC (11.5x14x3.37mm) package. |