| 2024/06/30 |
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PCN(Product Change Notice)
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Supplier Notice No.:BLAS-21SMFQ723 Title: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media
Description of Change: Pre Change Assembly Site: Unisem (M) Berhad Perak, Malaysia(UNIS) Post Change Assembly Site:Unisem Gopeng(UNIG)
Change Impact: None
Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.
Change Implementation Status: In Progress
Estimated Qualification Completion Date: June 2024
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| 2025/06/30 |
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PCN(Product Change Notice)
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PCN No.:BLAS-21SMFQ723 Change No.:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.
Estimated First Ship Date: 30 June 2025 (date code: 2527)
Revision History: September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs. |
| 2025/08/18 |
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PCN(Product Change Notice)
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PDN No.: DSNO-10YXVO948 Description: CCB 7364.003 Final Notice: Qualification?of?Microchip?Technology Colorado ? Fab 5 (MCSO) as a new fabrication location?for?selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages. |