PCN/PDN/NRND Information LM193DRG4｜shopping sight of electronic components and semiconductor- chip one stop

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PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일	통지 종류	통지 정보
2024/06/26	PCN (제품 변경 통지)	Supplier Notice No.:20240327005.1 Title: Qualification of RFAB using qualified Process Technology, Die Revision, and additional Assembly site options Description of Change: Texas Instruments is pleased to announce the addition of RFAB using the TIB qualified process technology and additional Assembly/Test site (MLA) options. Reason for Change: These changes are part of our multiyear plan to transition products from our 150-milimeter factories to newer, more efficient manufacturing processes and technologies, underscoring our commitment to product longevity and supply continuity. Anticipated impact on Form, Fit, Function, Quality or Reliability (positive /negative): None Proposed 1st Ship Date: June 26, 2024
2025/03/05	PCN (제품 변경 통지)	Supplier Notice No.:20250225006.0 Title: Datasheet for LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Description of Change: Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated. The datasheet number will be changing. Device Family: LM393B, LM2903B, LM193,LM293, LM393 and LM2903 Change From: / Change To: SLCS005AF / SLCS005AG These changes may be reviewed at the datasheet links provided. http://www.ti.com/product/LM393B Reason for Change: To accurately reflect device characteristics. Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): No anticipated impact.
2025/03/09	PCN (제품 변경 통지)	The product datasheet(s) is being updated as summarized below.
2026/01/01	PCN (제품 변경 통지)	PCN No.:20251003000.1 Change Desc.:Qualification of additional Assembly sites for select SOIC devices Reason for Change: Continuity of Supply Proposed 1st Ship Date: January 01, 2026
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