| 2025/07/22 |
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PCN(Product Change Notice)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 8/9th notification. |
| 2025/09/01 |
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PCN(Product Change Notice)
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PCN No. DSNO-23ZLEM284 Change Desc. Qualification of palladium coated copper with gold flash (CuPdAu) as new bond wire material for RE370V28, RE370V28T, RE46C400V28, RE46C400V28T, RE46C401V28, RE46C401V28T, RE46C420V28T, RE46C421V28T, RE46C422V32, RE46C422V32T, RE46C700IV28, RE46C700IV28T, RE46C701IV28, RE46C701IV28T, RE46C705IV32, RE46C705IV32T, RE46C730IV28 and RE46C730IV28T catalog part numbers (CPN) available in 28L VQFN (4x4x1.0mm) and 32L VQFN (5x5x1mm) packages at MTAI assembly site.
Estimated Qualification Completion Date: September 2025
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