2016年3月29日

东京—东芝公司（TOKYO：6502）旗下半导体与存储产品公司今日宣布，为其搭载DMOS FET[1]型漏型输出（sink-output）[2]驱动器的新一代高效晶体管阵列“TBD62064A系列”和“TBD62308A系列”产品推出新的封装，这些产品已广泛应用于电机和继电器驱动等应用中。
新产品“TBD62064AFAG”和“TBD62308AFAG”采用表面贴装型标准封装“SSOP24”。批量生产即日启动。
 

基于一些客户的报告，东芝对其现有封装中所使用的HSOP型表面贴装型封装的操作进行了分析，并已发现，在电路板封装过程中可能存在焊料难以流向散热片的问题。为此，东芝开发出一种SSOP型封装，该封装具有与HSOP封装相同的散热性能。SSOP拥有标准的1mm脚距引脚，不含散热片，电路板封装非常简便。

这些新产品配置4个50V / 1.5A额定输出通道，适合驱动恒压单极步进电机。

东芝在其新产品中采用了DMOS FET型输出驱动器，以实现客户降低功率损耗所需的高效率—DMOS FET无需基极电流，其保持低导通电阻，因而在器件单位面积上可接受高电流密度。

新产品的主要特性

■高效驱动
与“TD62xxxA系列”相比，“TBD62xxxA系列”晶体管阵列降低功率损耗约38%[3]。

■高压、大电流驱动
输出电压 / 电流的绝对最大定额值为50V / 1.5A。

■满足各种需求的封装。
该系列产品包括DIP封装和SSOP/HSOP封装，情趣商品、娱乐和工业设备领域对前者存在强劲需求，后者支持大电流（1.5A）驱动和表面贴装。

应用
游乐设备（弹球盘和老虎机）、家用电器（空调和冰箱）及工业设备（自动售货机、ATM等银行终端、办公室自动设备和工厂自动化设备）

与现有产品的对比

 

产品阵容

 

[1] DMOS FET：双扩散型MOSFET
[2] 漏型输出：一种电流输出类型（拉式）
[3] 在Tj=90oC且IOUT为1.25A的条件下

如需了解有关此产品的更多信息，请访问：
http://toshiba.semicon-storage.com/cn/product/linear/transistor-array.html?mm=cp160407&no=03

*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞
http://toshiba.semicon-storage.com/cn/?mm=cp160407&no=04

 

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Companies Website:
http://toshiba.semicon-storage.com/cn/?mm=cp160407&no=04

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