| 2024/09/02 |
|
PCN(Product Change Notice)
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Supplier Notice No.:24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change: Old/Marking composition with no 2D marking New/New marking composition with 2D marking for production assembly
Motivation: to enhance traceability
Intended start of delivery: 2024-09-02 |
| 2025/01/24 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/24/14725 Title: STM32H7Rxx and STM32H7Sxx - product enhancement and BOM optimization
Description: Old/ STM32H7x - (Die485 ? cut1.2 revision Y) product enhancement shows some limitations Errata Sheet : ES0596 rev 4 July 2024) describes the limitations Datasheets : DS14359 rev2 (crypto) & DS14360 rev 2 (non crypto) are impacted Assembly : Gold wire Bonding wire material
New/ STM32H7x - (Die485 - cut2.0 revision B) product enhancement as below Errata Sheet new release : ES0596 rev5 october 2024 fixes those limitations. Datasheets new releases : DS14359 rev3 (crypto) & DS14360 rev3 (non crypto) are updated. Assembly : Copper Palladium Bonding wire material.
Anticipated Impact on form,fit, function, quality, reliability or processability? Functionality enhancement
Intended start of delivery: 2025-01-24 |
| 2025/07/18 |
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PCN(Product Change Notice)
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PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/09/02 |
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PCN(Product Change Notice)
|
Supplier Notice No.:MDG/24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
Motivation: to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change
Intended start of delivery: 2025-09-02
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| 2025/11/10 |
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PCN(Product Change Notice)
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PDN No.: EMBEDDED PROCESSING/25/15372 Description: STM32H7Rxx and STM32H7Sxx - Product BootLoader & secure firmware enhancement |