| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/07/15 |
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PCN(Product Change Notice)
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Specification Change Issue date 2021-09-01
STM32G0 128K/512K, STM32G03 64K & STM32G05 64K - Datasheets enhancement Modification of datasheet: parameters/electrical specification (min./max./typ. values) and/or AC/DC specification
Reason / motivation for change Datasheet enhanced to align VREFBUF values with actual product characteristics Customer Benefit QUALITY IMPROVEMENT
Timing / schedule Date of qualification results 2021-07-15 Intended start of delivery 2021-07-15 |
| 2022/04/24 |
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PCN(Product Change Notice)
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Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in Germany & Eastern Europe. The change also includes personnel, location, logistic model.. |
| 2022/05/07 |
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PCN(Product Change Notice)
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STM32G03 and STM32G04 64K-product enhancement |
| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/05/15 |
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PCN(Product Change Notice)
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Notification related for 2nd EMEA DC project in Frankfurt |
| 2022/05/26 |
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PCN(Product Change Notice)
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STM32G03 and STM32G04 64K - product enhancement Timing / schedule Intended start of delivery 2022-05-26 |
| 2024/04/12 |
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PCN(Product Change Notice)
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Description of change Old Front-end sources for Die 466 cut1.2 : - TSMC (Taiwan) FAB14 New Front-end sources for Die 466 cut1.2 : - TSMC (Taiwan) FAB14 - Crolles 300 ( France) additional source
Timing / schedule Intended start of delivery 2024-07-29 |
| 2024/09/02 |
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PCN(Product Change Notice)
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ST AGRATE (Italy) additional source for STM32G03x/04x and STM32L41x/42x~products in M10/90nm technology. |
| 2024/09/03 |
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PCN(Product Change Notice)
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Description of change
Old Front-end sources for Die 466 cut1.2 : - TSMC (Taiwan) FAB14 - Crolles 300 ( France) Front-end sources for Die 464 cut1.0 - TSMC (Taiwan) FAB14
New Front-end sources for Die 466 cut1.2 : - TSMC (Taiwan) FAB14 - Crolles 300 ( France) - Agrate 300 (Italy) - additional source Front-end sources for Die 464 cut1.0 - TSMC (Taiwan) FAB14 - Agrate 300 (Italy) - additional source
Timing / schedule Intended start of delivery 2024-11-26 |
| 2024/09/10 |
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PCN(Product Change Notice)
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Description of change Old: Front-end sources for Die 466 cut1.2 : - TSMC (Taiwan) FAB14 - Crolles 300 ( France) Front-end sources for Die 464 cut1.0 - TSMC (Taiwan) FAB14 New: Front-end sources for Die 466 cut1.2 : - TSMC (Taiwan) FAB14 - Crolles 300 ( France) - Agrate 300 (Italy) - additional source Front-end sources for Die 464 cut1.0 - TSMC (Taiwan) FAB14 - Agrate 300 (Italy) - additional source
Timing / schedule Intended start of delivery 2024-11-26 |
| 2026/01/07 |
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PCN(Product Change Notice)
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PCN No. EMBEDDED PROCESSING/25/15803 Change Desc. Description of change Old: JSCC (China) UFQFPN 4X4 28L Current Bill Of Material: - Gold wire - Molding compound EME-G770HCD - Leadframe copper, pre-plated New: JSCC (China) UFQFPN 4X4 28L new Bill Of Material: - CuPd wire - Molding compound EME-G700LA-LA - Leadframe copper, post-plated
Timing / schedule Intended start of delivery 2026-01-07 |