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目前的商品价格将适用于以下


・根据顾客的购买情况可以享受优惠和折扣
・关于折扣仅限于从本网站直接下单的订单
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・不能与其它优惠同时使用

PCN/PDN/NRND信息

PCN(产品/工艺变更通知)和PDN(生产中断通知)信息。

通知日期 通知文书 通知类型 通知信息
2025/02/17 PCN(产品规格变更通知) Supplier Notice No.:MDG/24/14375#1
Title:
AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.

Description of change:
(Updated document)
Old/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire

New/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-17
2025/02/28 PCN(产品规格变更通知) ST Crolles (France) additional source for STM32G41x/G47x/G48x, STM32L43x/L44x/L4Zx and STM32L47x/L48x products in M10/90nm technology.
2025/07/03 PCN(产品规格变更通知) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(3/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
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PCN/PDN/NRND信息
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