| 2020/03/10 |
|
PCN(Product Change Notice)
|
JSCC capacity increase - for listed products
[Old]
Silver wire bonding
[New]
Silver wire bonding
Gold wire bonding |
| 2020/06/12 |
|
PCN(Product Change Notice)
|
For StatsChipPAC JSCC Jiangyin China capacity increase
Silver wire bonding > Silver wire bonding + Gold wire bonding |
| 2021/01/08 |
|
PCN(Product Change Notice)
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/07/15 |
|
PCN(Product Change Notice)
|
Specification Change
Issue date 2021-09-01
STM32G0 128K/512K, STM32G03 64K & STM32G05 64K - Datasheets enhancement
Modification of datasheet:
parameters/electrical specification (min./max./typ. values)
and/or AC/DC specification
Reason / motivation for change
Datasheet enhanced to align VREFBUF values with actual product characteristics
Customer Benefit
QUALITY IMPROVEMENT
Timing / schedule
Date of qualification results 2021-07-15
Intended start of delivery 2021-07-15 |
| 2021/07/30 |
|
PCN(Product Change Notice)
|
PRODUCT / PROCESS CHANGE NOTIFICATION
ASE Kaohsiung (Taiwan) additional source in LQFP7X7 package - extended list of products
Issue date 2021-07-08
Change Category: Transfer
Type of change:
Line transfer for a full process or process brick
(process step, control plan, recipes) from one
site to another site: Assembly site (SOP 2617)
Manufacturing Location: ASE Kaohsiung (Taiwan)
Description of change
Old Back-end sources:
- Stats ChipPAC Jiangyin China (JSCC)
New Back-end sources:
- Stats ChipPAC Jiangyin China (JSCC)
- ASE Kaohsiung Taiwan - Additional source
Date of qualification results 2021-06-25
Intended start of delivery 2021-07-30 |
| 2022/05/08 |
|
PCN(Product Change Notice)
|
NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2022/05/26 |
|
PCN(Product Change Notice)
|
STM32G03 and STM32G04 64K - product enhancement
Timing / schedule
Intended start of delivery 2022-05-26 |
| 2023/05/15 |
|
PCN(Product Change Notice)
|
ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package
copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x
and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2024/04/12 |
|
PCN(Product Change Notice)
|
Description of change
Old Front-end sources for Die 466 cut1.2 :
- TSMC (Taiwan) FAB14
New Front-end sources for Die 466 cut1.2 :
- TSMC (Taiwan) FAB14
- Crolles 300 ( France) additional source
Timing / schedule Intended start of delivery 2024-07-29 |
| 2024/04/15 |
|
PCN(Product Change Notice)
|
Description of change
Old Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire
Timing / schedule Intended start of delivery 2024-06-30 |
| 2024/06/30 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MDG/24/14363
Title:
JJSCC (China) LQFP7x7 32L/48L , LQFP10x10 64L and LQFP12x12 80L package copper palladium bonding wire introduction on STM32C0x, STM32G0/G4x, STM32H5/H7x, STM32L4/L5x and STM32U5x listed products
Description of change:
Old Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire
Anticipated Impact on form,fit,function, quality, reliability orprocessability?
no impact on form, Fit, Function
Intended start of delivery:
2024-06-30 |
| 2024/09/02 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Intended start of delivery:
2024-09-02 |
| 2024/09/03 |
|
PCN(Product Change Notice)
|
Description of change
Old
Front-end sources for Die 466 cut1.2 :
- TSMC (Taiwan) FAB14
- Crolles 300 ( France)
Front-end sources for Die 464 cut1.0
- TSMC (Taiwan) FAB14
New
Front-end sources for Die 466 cut1.2 :
- TSMC (Taiwan) FAB14
- Crolles 300 ( France)
- Agrate 300 (Italy) - additional source
Front-end sources for Die 464 cut1.0
- TSMC (Taiwan) FAB14
- Agrate 300 (Italy) - additional source
Timing / schedule Intended start of delivery 2024-11-26 |
| 2024/09/10 |
|
PCN(Product Change Notice)
|
Description of change
Old: Front-end sources for Die 466 cut1.2 :
- TSMC (Taiwan) FAB14
- Crolles 300 ( France)
Front-end sources for Die 464 cut1.0
- TSMC (Taiwan) FAB14
New: Front-end sources for Die 466 cut1.2 :
- TSMC (Taiwan) FAB14
- Crolles 300 ( France)
- Agrate 300 (Italy) - additional source
Front-end sources for Die 464 cut1.0
- TSMC (Taiwan) FAB14
- Agrate 300 (Italy) - additional source
Timing / schedule Intended start of delivery 2024-11-26 |
| 2024/12/04 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MICROCONTROLLERS/24/15033
Title:
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2024-12-04
Intended start of delivery 2024-12-04 |
| 2024/12/04 |
|
PCN(Product Change Notice)
|
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products |
| 2025/07/18 |
|
PCN(Product Change Notice)
|
PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/09/02 |
|
PCN(Product Change Notice)
|
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2025-09-02
|
| 2026/02/05 |
|
PCN(Product Change Notice)
|
PDN No.: EMBEDDED PROCESSING/25/15887
Description: TSHT(China) additional LQFP7x7 32L/48L package assembly line for STM32G07x/G08x and STM32G03x/04x listed products. |
