| 2020/04/13 |
|
PCN(Product Change Notice)
|
CCB 4202 Final Notice: Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire. |
| 2020/04/13 |
|
PCN(Product Change Notice)
|
CCB 4203 Final Notice: Qualification of G600V as an additional/alternative mold compound material for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire. |
| 2024/06/10 |
|
PCN(Product Change Notice)
|
Microchip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products. |
| 2024/06/24 |
|
PCN(Product Change Notice)
|
Microchip has decided to not qualify Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx, ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages. |