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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2025/08/01 PCN(Product Change Notice) PCN No.:202507010I
Change Desc.:KW45/K32W1480 Chip Errata Update from Rev 1.4 December 2022 to Rev 2.0 July 2025

The revision history included in the updated documents provides a detailed description of the changes.

Reason :
The errata was added or revised for additional technical clarification on some device features.
ERR052403 FlexCAN: CAN frame drops in Enhanced RX FIFO when message buffer (MB) is locked for more than 1 CAN frame time (33 us).
ERR052407 DCDC: Failure changing to Low drive-strength mode.
ERR052438 FlexCAN: CAN frame may drop when using Enhanced RX FIFO.
ERR052558 FlexCAN: Message buffer (MB) overrun status is cleared when reading Enhanced RX FIFO(ERF).
ERR052742 FRO6M clock is not stable.

Effective Date: Aug 01, 2025
2026/01/28 PCN(Product Change Notice) PCN No. 202509013F01
Change Desc.
NXP Semiconductors announces hot temperature test elimination
from the Final Test production flow for the KW45x41xxxAFxBx associated.
Reason
Qualification of hot temperature test elimination for improved capacity and customer supply assurance.

Planned first shipment Jan 23, 2026
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PCN/PDN/NRND Information
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