| 2022/12/15 |
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PCN(Product Change Notice)
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STM32U575xx and STM32U585xx - product enhancement
Timing / schedule Intended start of delivery 2022-12-15 |
| 2023/08/28 |
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PCN(Product Change Notice)
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ASE Kaohsiung (Taiwan) - qualification of a second source substrate supplier (SCC - Shennan Circuit Company) for BGA package, size from BGA5x5 to BGA18x18, for listed products
Old First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different impacted products. New First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product. Second source supplier SCC for all impacted products.
Timing / schedule Intended start of delivery 2023-09-06 |
| 2024/05/21 |
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PCN(Product Change Notice)
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Description of change Old Assembly lines / wire bonding: - AMKOR (Philippines) / Gold wire - ASE Kaohsiung (Taiwan) / Gold wire New Assembly lines / wire bonding: - AMKOR (Philippines) / Gold wire - ASE Kaohsiung (Taiwan) / Gold wire - ASE Kaohsiung (Taiwan) / Copper Palladium wire - Additional Source
Timing / schedule Intended start of delivery 2024-06-05
|
| 2024/10/01 |
|
PCN(Product Change Notice)
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Supplier Notice No.:MDG/24/14486 Title: STM32U575x & STM32U585x - product Enhancement
Description: Old/STM32U575xx and STM32U585xx - (Die482 -cut3.1 revision W) product shows several limitations as described in Errata Sheet(ES0499 - Rev 9 -January 2024)
New/STM32U575xx and STM32U585xx - (Die482 - cut3.3 revision U) product enhancement fixes three limitations related to low-power modes as described in Errata Sheet (ES0499 - Rev 10 -July 2024)
Anticipated Impact on form,fit, function, quality, reliability or processability? Functionality enhancement
Motivation: Improvements was implemented to increase robustness, performances and quality of our products.
Intended start of delivery: 2024-10-01 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(3/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |