| 2020/03/10 |
|
PCN(Product Change Notice)
|
JSCC capacity increase - for listed products
[Old]
Silver wire bonding
[New]
Silver wire bonding
Gold wire bonding |
| 2020/06/12 |
|
PCN(Product Change Notice)
|
For StatsChipPAC JSCC Jiangyin China capacity increase
Silver wire bonding > Silver wire bonding + Gold wire bonding |
| 2021/01/08 |
|
PCN(Product Change Notice)
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/07/29 |
|
PCN(Product Change Notice)
|
Die redesign: Mask or mask set change with new die design
- Design changes in active elements.
Manufacturing Location
TSMC Fab14 (Taiwan)/ Crolles (France)
Old
Current Die revision:
- STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan)
Current RM0090 Rev 8 - Reference Manual
STM32F405/415, STM32F407/417, STM32F427/437
and STM32F429/439 advanced ArmR-based 32-bit MCUs
New
New Die Revision to improve manufacturing efficiency:
- STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan)
New RM0090 Rev 19 - Reference Manual - february 2021
STM32F405/415, STM32F407/417, STM32F427/437
and STM32F429/439 advanced ArmR-based 32-bit MCUs
Timing / schedule
Date of qualification results 2021-05-14
Intended start of delivery 2021-12-22 |
| 2021/08/30 |
|
PCN(Product Change Notice)
|
- Specification Change
OLD
Refer to application Note AN2606 version 48.0 April 2021 :
- STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0.
- STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1.
NEW
Refer to application Note AN2606 version 49.0 July 2021 :
- All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 |
| 2021/08/30 |
|
PCN(Product Change Notice)
|
STM32F46X 1MB product BootLoader improvement
Product Category: STM32F46X 1MB
Issue date 2021-07-13
Description
Old
Refer to application Note AN2606 version 48.0 April 2021 :
- STM32F40xxx/41xxx devices in WLCSP90
package have Bootloader version V9.0.
- STM32F40xxx/41xxx devices in all other
packages have Bootloader version V3.1.
New
Refer to application Note AN2606 version 49.0 July 2021 :
- All STM32F40xxx/41xxx devices in any
package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/08/30 |
|
PCN(Product Change Notice)
|
Specification Change
STM32F46X 1MB product BootLoader improvement
Description
Refer to application Note AN2606 version 49.0 July 2021
- All STM32F40xxx/41xxx devices in any
package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/12/22 |
|
PCN(Product Change Notice)
|
Die redesign: Mask or mask set change with new die design - Design changes in active elements.
Description of change:
OLD:
Current Die revision:
- STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan)
Current RM0090 Rev 8 - Reference Manual
STM32F405/415, STM32F407/417,
STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs.
New:
New Die Revision to improve manufacturing efficiency:
- STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan)
New RM0090 Rev 19 - Reference Manual -february 2021
STM32F405/415, STM32F407/417,
STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs
Intended start of delivery 2021-12-22 |
| 2024/08/22 |
|
PCN(Product Change Notice)
|
Old: Marking composition with no 2D marking
New: New marking composition with 2D marking for production assembly
Timing / schedule Intended start of delivery : 2024-09-02 |
| 2024/08/28 |
|
PCN(Product Change Notice)
|
Description of change
Old: Marking composition with no 2D marking
New: New marking composition with 2D marking for production assembly
Timing / schedule Intended start of delivery 2024-09-02 |
| 2024/12/04 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MICROCONTROLLERS/24/15033
Title:
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2024-12-04
Intended start of delivery 2024-12-04 |
| 2024/12/04 |
|
PCN(Product Change Notice)
|
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products |
| 2025/02/03 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:PCN MDG/24/14976
Title:
JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products
Description:
Old/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire
New/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire
Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function
Intended start of delivery:
2025-02-03 |
| 2025/05/20 |
|
PCN(Product Change Notice)
|
ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x
Description of change
Old Current assembly sites (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
You may refer to 15271_Additional
information.pdf document for further details.
New Current assembly sites: (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
Additional assembly site for extended capacity:
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
|
| 2025/07/03 |
|
PCN(Product Change Notice)
|
PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(3/3)
old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for
production assembly |
| 2025/07/18 |
|
PCN(Product Change Notice)
|
PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/12/15 |
|
PCN(Product Change Notice)
|
PCN No.:EMBEDDED PROCESSING/25/15423
Change Desc.:JSCC (China) additional source for legacy STM32F2x and STM32F4x listed products in LQFP
10x10 64L package
Intended start of delivery:
2025-12-15 |
