| 2024/10/21 |
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PCN(Product Change Notice)
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The ENEC marking for some switch product series will be removed due to duplication with existing UL certification. |
| 2025/02/10 |
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PCN(Product Change Notice)
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Supplier Notice No.:LFPCN-DI-BTA-2025-001/01 Title: Addition of in house second source for TO-268-3 Discrete IGBTs
DESCRIPTION OF CHANGE: 1.Change in assembly house: SBU-Lipa as a new supplier and second source for TO-268-3 package. Addition of in-house SBU-Lipa assembly house as a new supplier and a second source for TO-268-3 package shall ease out the capacity constraint with the existing OSAT and shall result in additional capacity. This shall help Littelfuse to support upcoming customer demands more effectively and efficiently. 2.Change in device marking 3.Change in inner box and tube label
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part number/s. |
| 2025/02/26 |
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PCN(Product Change Notice)
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We will be adding a new alternative epoxy molding compound (EMC) to the back-end manufacturing of some discrete MOSFETs, IGBTs, multi-chip, and bipolar products. #: LFPCN-DMI-BTA-2024-003/01 |
| 2025/02/26 |
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PCN(Product Change Notice)
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Supplier Notice No.:LFPCN-DMI-BTA-2024-00301 Title: Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices
DESCRIPTION OF CHANGE: Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers
Affected parts shipped from February 26, 2025, will only be with the new EMC.
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| 2025/02/26 |
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PCN(Product Change Notice)
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Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302 Title: Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs)
DESCRIPTION OF CHANGE: Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.
Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus. |