| 2025/06/26 |
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PCN(Product Change Notice)
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PDN No.: NTDO-07ARFY910 Description: CCB 6443 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected dsPIC33FJ6xx, PIC18F96J6xx, PIC18F97J6xx, PIC24FJ64Gxx, PIC24FJ128xx, PIC24FJ192xx, PIC24FJ256xx, PIC24FJ96Gxx, dsPIC33FJ2xx, PIC24HJ64Gxx, dsPIC33FJ1xx, PIC24HJ128xx, PIC24HJ256xx and dsPIC33FJ3xx device families available in 64L and 100L TQFP (14x14x1 mm) package. |
| 2025/07/22 |
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PCN(Product Change Notice)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 2/9th notification. |