PCN/PDN/NRND Information STM32F745IET6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND 정보

PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일	통지 종류	통지 정보
2024/09/02	PCN (제품 변경 통지)	Supplier Notice No.:24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products Description of change: Old/Marking composition with no 2D marking New/New marking composition with 2D marking for production assembly Motivation: to enhance traceability Intended start of delivery: 2024-09-02
2025/05/20	PCN (제품 변경 통지)	ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x Description of change Old Current assembly sites (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. You may refer to 15271_Additional information.pdf document for further details. New Current assembly sites: (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. Additional assembly site for extended capacity: - ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
2025/08/12	PCN (제품 변경 통지)	Supplier Notice No.:MICROCONTROLLERS/25/15304 Title:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology. Description: Old/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1 New/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1 Additional source - ST Rousset (France) RS8F revision 2 Anticipated Impact on form,fit,function, quality, reliability or processability? No change on Form, Fit or Function - same datasheet. Intended start of delivery: 2025-08-12
2025/08/12	PCN (제품 변경 통지)	PCN No.:EMBEDDED PROCESSING/25/15304 Change Desc.:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology. Intended start of delivery: 2025-08-12
2025/09/02	PCN (제품 변경 통지)	ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
2025/09/02	PCN (제품 변경 통지)	Supplier Notice No.:MDG/24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly Motivation: to enhance traceability Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change Intended start of delivery: 2025-09-02
2026/01/05	PCN (제품 변경 통지)	PDN No.: EMBEDDED PROCESSING/25/15429 Description: ASE KaoHsiung (Taiwan) LQFP24x24 standardized package introduction on STM32F2x/F4x/F7x and STM32H5x listed products.
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PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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PCN/PDN/NRND 정보

PCN/PDN 대상제품 정보