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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2024/09/18 PCN(Product Change Notice) Supplier Notice No.:LFPCN-DMI-BTA-2024-00201
Title:
Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs

DESCRIPTION OF CHANGE:
1.Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-264, PLUS264 and ISOPLUS264 (ISOPLUS i5-PAC) packages. This will further streamline and enhance our supply chain efficiencies.
2.Change in device marking
3.Change in inner box and tube labels, and tube dimensions

Form, fit, function changes:
Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.
2024/10/21 PCN(Product Change Notice) The ENEC marking for some switch product series will be removed due to duplication with existing UL certification.
2024/10/31 PCN(Product Change Notice) We are adding our in-house assembly line at Lipa as a new supplier and alternative source
for TO-264, PLUS264, ISOPLUS264 (ISOPLUS i5-PAC) packages.
Effective date: Undecided
2025/02/26 PCN(Product Change Notice) We will be adding a new alternative epoxy molding compound (EMC) to the back-end manufacturing
of some discrete MOSFETs, IGBTs, multi-chip, and bipolar products.

#: LFPCN-DMI-BTA-2024-003/01
2025/02/26 PCN(Product Change Notice) Supplier Notice No.:LFPCN-DMI-BTA-2024-00301
Title:
Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices

DESCRIPTION OF CHANGE:
Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP).
The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.

Form, fit, function changes:
Littelfuse does not anticipate any change in form/fit/function of the affected part numbers

Affected parts shipped from February 26, 2025, will only be with the new EMC.
2025/02/26 PCN(Product Change Notice) Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302
Title:
Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs)

DESCRIPTION OF CHANGE:
Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP).
The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.

Form, fit, function changes:
Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.

Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus.
2025/08/12 PCN(Product Change Notice) PCN No.:LFPCN-DMI-BTA-2024-002/02
Change Desc.:Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs
This PCN is a revised version of the previously issued PCN LFPCN-DMI-BTA-2024-002/01, dated September 18, 2024, which informed you of an additional backend manufacturing site for the discrete MOSFET and IGBT parts listed in Appendix C. This updated version includes change in lead finish.
2025/08/19 PCN(Product Change Notice) PCN No. LFPCN-DMI-BTA-2024-002-02
Change Desc.
We are adding our in-house assembly line at Lipa as a new and alternate supplier
for TO-264, PLUS264, and ISOPLUS264 (ISOPLUS i5-PAC) packages.
(Additional Information) Lead Finish Change: Lipa: Matte Finish
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PCN/PDN/NRND Information
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