| 2024/06/30 |
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PCN(Product Change Notice)
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Supplier Notice No.:BLAS-21SMFQ723 Title: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media
Description of Change: Pre Change Assembly Site: Unisem (M) Berhad Perak, Malaysia(UNIS) Post Change Assembly Site:Unisem Gopeng(UNIG)
Change Impact: None
Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.
Change Implementation Status: In Progress
Estimated Qualification Completion Date: June 2024
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| 2025/06/30 |
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PCN(Product Change Notice)
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PCN No.:BLAS-21SMFQ723 Change No.:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.
Estimated First Ship Date: 30 June 2025 (date code: 2527)
Revision History: September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs. |
| 2025/07/18 |
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PCN(Product Change Notice)
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PCN No. MFOL-24SIIW084 Change Desc. Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.
Estimated First Ship Date: 18 July 2025 (date code: 2529) |
| 2025/08/18 |
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PCN(Product Change Notice)
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PDN No.: DSNO-10YXVO948 Description: CCB 7364.003 Final Notice: Qualification?of?Microchip?Technology Colorado ? Fab 5 (MCSO) as a new fabrication location?for?selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages. |