PCN/PDN/NRND Information TJA1021T/10/C,118｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2023/12/31	PCN(Product Change Notice)	Introduction of Multi-Source Optical Shrink Versions of Various CAN/LIN Products For the PL IVN CAN/LIN products TJA1021, TJA1022, TJA1024, TJA1027, TJA1029, TJA1042, TJA1043, TJA1044, TJA1046 and TJA1057 optical shrink product versions will be introduced. The Bill-of-Material (BoM) of those new shrink product versions will be using copper (Cu) bondwire, with the associated mold compound and die attach. These new product versions will be introduced as multi-source, i.e. using multiple front-end diffusion waferfabs and back-end assembly and final test sites.
2024/01/20	PCN(Product Change Notice)	Supplier Notice No.:202309003F01 Title: Introduction of Optical Shrink Quad Source Versions of SO-package TJA1021 Product Description : For the PL IVN SO-package LIN product TJA1021, optical shrink Quad Source product versions will be introduced. The Bill-of-Material (BoM) of those new shrink product versions will be using copper (Cu) bondwire, with the associated mold compound and die attach. Reason: These changes will help to continue NXP's Global Business Continuity Management process to establish an industrial base that is agile, robust and can reliably service the long term forecasted market growth of IVN products. Production: Planned first shipment Jan 20, 2024 Anticipated Impact on Form, Fit, Function, Reliability or Quality: No Impact on form, fit, function, reliability or quality
2024/05/21	PCN(Product Change Notice)	Supplier Notice No.:202309003F01U01 Tite: Introduction of Optical Shrink Quad Source Versions of SO-package TJA1021 Product Description: For the PL IVN SO-package LIN product TJA1021, optical shrink Quad Source product versions will be introduced. The Bill-of-Material (BoM) of those new shrink product versions will be using copper (Cu) bondwire, with the associated mold compound and die attach. Reason: These changes will help to continue NXP's Global Business Continuity Management process to establish an industrial base that is agile, robust and can reliably service the long term forecasted market growth of IVN products. Planned first shipment: May 21, 2024 Update Information: - Improved PCN attachment, with more (clear) description of changes - Typos corrected in reliability qualification report - Updated ZVEI Delta Qualification Matrix (DeQuMa)
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PCN/PDN/NRND Information

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PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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