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THPM4601A  THine Electronics  DC/DC Switching Regulators  -  商品詳細情報

THPM4601A THine Electronics 1
THPM4601A THine Electronics 1
THPM4601A THine Electronics 2
THPM4601A THine Electronics 3
THPM4601A THine Electronics 4

The images are for reference only. For the precise specifications, refer to the product specifications.

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THPM4601A

THPM4601A

THine Electronics

DC/DC Switching Regulators

THine Electronics

DC/DC Switching Regulators

Added to bookmarks.
Product Overview

POL Power Module

Lifecycle Status : Active
ECCN EAR99

HTSN 8542900000

Product Overview

POL Power Module

Lifecycle Status : Active
ECCN EAR99

HTSN 8542900000

Product Information

Related Videos
Data sheet
Design/Simulation Data
Other Documents

Specifications

Manufacturer name
THine Electronics
Product name
THPM4601A
Product classification
DC/DC Switching Regulators
Lifecycle Status
Active
RoHS
RoHS
Switching style
Step-down(Buck)
Type
Power Module
Fan-out
1
Output Power
4V
Maximum input voltage
16V
Output voltage
0.6 to 5.5V
Input voltage
4 to 16V
Operating temperature range
-40 to 85C
Output voltage accuracy
0.8%
Package
133pin LGA
Output current
0 to 12A
Manufacturer Packaging
Tape & Reel
Manufacturer packaging quantity
200

If you find an error in the product information, please let us know here.

Details

    "Our Intelligence Inductor Power Module offers significant benefits in high density Point of Load modules and represents the next step in POL integration.

    <Suitable for>
    ASIC, ASSP, FPGA, DSP, DDR

    <Features>
    1. High Efficiency - Inductor-based package allows very low DCR, reduced losses

    Compared to conventional packaging technologies, “this inductor technology” reduces constraints on the inductor size. This allows for larger gauge wire and coil diameters to be used within the inductor structure which results in lower power losses and a high efficiency module.

    2. High Power Density - Solutions require minimal board space
    The small size and very low profile (3 mm) package reduces board space, allowing higher density designs.

    3. Cooler Operating Temp. - Packaged in high thermal conductivity magnetic material
    The inductor body acts as a heat sink to evenly sistribute heat, produced by the IC and inductor, across the package and dissipate it to the ambient air. The measured surface temperature is reduced by up to 11.5℃ compared to a module with an internal inductor under identical conditions. High thermal conductivity avoids “hot spots”.

    4. Low Radiated EMI - Core material provides electro-Magnetic shielding
    The inductor material is conductive and acts as a shield over the internal components. All internal power traces are very short, minimizing the loop area and further reducing radiated EMI.

    We have the other line-ups upon Vout/Iout."