| 2020/03/10 |
|
PCN(Product Change Notice)
|
JSCC capacity increase - for listed products
[Old]
Silver wire bonding
[New]
Silver wire bonding
Gold wire bonding |
| 2020/06/12 |
|
PCN(Product Change Notice)
|
For StatsChipPAC JSCC Jiangyin China capacity increase
Silver wire bonding > Silver wire bonding + Gold wire bonding |
| 2021/01/08 |
|
PCN(Product Change Notice)
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/07/15 |
|
PCN(Product Change Notice)
|
Specification Change
Issue date 2021-09-01
STM32G0 128K/512K, STM32G03 64K & STM32G05 64K - Datasheets enhancement
Modification of datasheet:
parameters/electrical specification (min./max./typ. values)
and/or AC/DC specification
Reason / motivation for change
Datasheet enhanced to align VREFBUF values with actual product characteristics
Customer Benefit
QUALITY IMPROVEMENT
Timing / schedule
Date of qualification results 2021-07-15
Intended start of delivery 2021-07-15 |
| 2022/05/08 |
|
PCN(Product Change Notice)
|
NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2022/12/20 |
|
PCN(Product Change Notice)
|
Product enhancement
Die redesign : Mask or mask set change with new die design like metallization (specifically chip frontside) or bug fix
Timing / schedule Intended start of delivery 2022-12-20 |
| 2023/03/04 |
|
PCN(Product Change Notice)
|
ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package~copper palladium bonding wire introduction. |
| 2023/05/15 |
|
PCN(Product Change Notice)
|
ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package
copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x
and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2024/04/15 |
|
PCN(Product Change Notice)
|
Description of change
Old Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire
Timing / schedule Intended start of delivery 2024-06-30 |
| 2024/06/30 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MDG/24/14363
Title:
JJSCC (China) LQFP7x7 32L/48L , LQFP10x10 64L and LQFP12x12 80L package copper palladium bonding wire introduction on STM32C0x, STM32G0/G4x, STM32H5/H7x, STM32L4/L5x and STM32U5x listed products
Description of change:
Old Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire
Anticipated Impact on form,fit,function, quality, reliability orprocessability?
no impact on form, Fit, Function
Intended start of delivery:
2024-06-30 |
| 2024/07/16 |
|
PCN(Product Change Notice)
|
ST Crolles (France) additional source for STM32G05x/7X/8x and STM32G0Bx/Cx~products in 90nm technology |
| 2024/07/23 |
|
PCN(Product Change Notice)
|
Old: Front-end sources for die 460 cut2.1 / die 467 cut 1.1
- TSMC (Taiwan) FAB14
New: Front-end sources for die 460 cut2.1 / die 467 Cut 1.1
- TSMC (Taiwan) FAB14
- Crolles 300 ( France) additional source
Timing / schedule Intended start of delivery 2024-09-13 |
| 2024/09/02 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Intended start of delivery:
2024-09-02 |
| 2024/12/04 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MICROCONTROLLERS/24/15033
Title:
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2024-12-04
Intended start of delivery 2024-12-04 |
| 2024/12/04 |
|
PCN(Product Change Notice)
|
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products |
| 2025/04/15 |
|
PCN(Product Change Notice)
|
Description of change
Old : Refer to application Note AN2606 Revision 65 - February 2025 :
STM32G071/81xx listed devices having the
Bootloader version 11.3
- Empty check Flag is cleared by error on the boot sequence
- I2C connection stretching the line for a long time which
is not supported by some HW hosts
New : Refer to application Note AN2606 Revision 66 - April 2025/
STM32G071/81xx devices will have the new
Bootloader version 11.4 :
- A global peripherals de-init was added on the
BL boot sequence to fix issues generating deinitialization
of all resources needed by the BL
SW so clearing the empty check flag.
- I2C connection stretching the line for a long
time which is not supported by some HW hosts is fixed
Timing / schedule Intended start of delivery 2025-04-15
|
| 2025/07/18 |
|
PCN(Product Change Notice)
|
PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/09/02 |
|
PCN(Product Change Notice)
|
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2025-09-02
|
