PCN/PDN/NRND Information STM32F411RET6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2020/03/10	PCN(Product Change Notice)	JSCC capacity increase - for listed products [Old] Silver wire bonding [New] Silver wire bonding Gold wire bonding
2020/06/12	PCN(Product Change Notice)	For StatsChipPAC JSCC Jiangyin China capacity increase Silver wire bonding > Silver wire bonding + Gold wire bonding
2021/01/08	PCN(Product Change Notice)	PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/05/08	PCN(Product Change Notice)	NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2024/12/04	PCN(Product Change Notice)	Supplier Notice No.:MICROCONTROLLERS/24/15033 Title: JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change Intended start of delivery: 2024-12-04 Intended start of delivery 2024-12-04
2024/12/04	PCN(Product Change Notice)	JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
2025/02/03	PCN(Product Change Notice)	Supplier Notice No.:PCN MDG/24/14976 Title: JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products Description: Old/ Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire New/ Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire Added Wire bonding material : - JSCC (China) Copper Palladium wire Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function Intended start of delivery: 2025-02-03
2025/05/20	PCN(Product Change Notice)	ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x Description of change Old Current assembly sites (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. You may refer to 15271_Additional information.pdf document for further details. New Current assembly sites: (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. Additional assembly site for extended capacity: - ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
2025/11/04	PCN(Product Change Notice)	Supplier Notice No.:MICROCONTROLLERS/25/15305 Title:ST ROUSSET (France) additional source for STM32F411x , STM32F412x and STM32F76x/F77x listed products in M10/90nm technology. Type of change: Line transfer for a full process or process brick(process step, control plan, recipes) from one site to another site: Wafer fabrication (SOP 2617) Manufacturing Location: ST Rousset (France) Anticipated Impact on form,fit, function, quality, reliability or processability? No change on Form, Fit or Function - same datasheets Intended start of delivery: 2025-11-04
2025/12/15	PCN(Product Change Notice)	PCN No.:EMBEDDED PROCESSING/25/15423 Change Desc.:JSCC (China) additional source for legacy STM32F2x and STM32F4x listed products in LQFP 10x10 64L package Intended start of delivery: 2025-12-15
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PCN/PDN/NRND Information

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Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
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