| 2022/09/22 |
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PCN(Product Change Notice)
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STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvement Timing / schedule Intended start of delivery : 2022-09-22 |
| 2025/02/17 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/24/14375#1 Title: AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.
Description of change: (Updated document) Old/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire
New/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function
Intended start of delivery: 2025-02-17 |
| 2025/03/28 |
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PCN(Product Change Notice)
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Description of change Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 65 - February 2025 New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 66 - April 2025
Timing / schedule Intended start of delivery 2025-04-17 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |