| 2021/07/08 |
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PCN(Product Change Notice)
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Amkor Philippines as an Alternate Site for TSSOP_4.4 At the additional factory, some packaging materials are different from the current factory. Assembly factory: Present: Carsem Malaysia (main factory) Future: Amkor Philippines (main factory), Carsem Malaysia Package material: Die Attach: Hysol QMI519 (current) => Abrestik 8290 (additional factory) MoldCompound: Sumitomo G700HA (current) => Sumitomo G700K (additional factory) |
| 2021/11/12 |
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PCN(Product Change Notice)
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Amkor Philippines as an Alternate Site for TSSOP_4.4 Publication Date: 10-Aug-2021 Effectivity Date: 12-Nov-2021 Description Of Change: ADI will be utilizing Amkor Philippines as an alternate assembly site for TSSOP_4.4. |
| 2025/10/03 |
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PCN(Product Change Notice)
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PCN No.:PCN 25_0162 Rev. - Change Desc.:Gold to Copper Wire Conversion Change of bond wire from Gold wire to Copper wire for all the parts listed, in specific subcon. BOM also updated to be compatible with Cu wire. ASECL: BOM compound G700LA and Die attach EN4900G. ATP: compound is Sumitomo G700LS and Die attach AB8290. UTAC: compound is G700LTD and Die attach AB8600. All materials have qualified and in production for ADI devices.
Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives. Note: ASE, Amkor, UTAC, all have been in Cu wire production for 10+ years and over billion units shipped to commercial and automotive customers.
Effectivity Date: 03-Oct-2025 (the earliest date that a customer could expect to receive changed material) |