PCN/PDN/NRND Information STM32F407IGH7｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2021/01/08	PCN(Product Change Notice)	PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2021/03/11	PCN(Product Change Notice)	AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package
2021/06/15	PCN(Product Change Notice)	Old> marking composition with no SS marking New> marking composition with additional SS marking
2021/07/29	PCN(Product Change Notice)	Die redesign: Mask or mask set change with new die design - Design changes in active elements. Manufacturing Location TSMC Fab14 (Taiwan)/ Crolles (France) Old Current Die revision: - STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France) - STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan) Current RM0090 Rev 8 - Reference Manual STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs New New Die Revision to improve manufacturing efficiency: - STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France) - STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan) New RM0090 Rev 19 - Reference Manual - february 2021 STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs Timing / schedule Date of qualification results 2021-05-14 Intended start of delivery 2021-12-22
2021/08/30	PCN(Product Change Notice)	- Specification Change OLD Refer to application Note AN2606 version 48.0 April 2021 : - STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0. - STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1. NEW Refer to application Note AN2606 version 49.0 July 2021 : - All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1
2021/08/30	PCN(Product Change Notice)	STM32F46X 1MB product BootLoader improvement Product Category: STM32F46X 1MB Issue date 2021-07-13 Description Old Refer to application Note AN2606 version 48.0 April 2021 : - STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0. - STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1. New Refer to application Note AN2606 version 49.0 July 2021 : - All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 Intended start of delivery 2021-08-30
2021/08/30	PCN(Product Change Notice)	Specification Change STM32F46X 1MB product BootLoader improvement Description Refer to application Note AN2606 version 49.0 July 2021 - All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 Intended start of delivery 2021-08-30
2021/12/22	PCN(Product Change Notice)	Die redesign: Mask or mask set change with new die design - Design changes in active elements. Description of change: OLD: Current Die revision: - STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France) - STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan) Current RM0090 Rev 8 - Reference Manual STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs. New: New Die Revision to improve manufacturing efficiency: - STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France) - STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan) New RM0090 Rev 19 - Reference Manual -february 2021 STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs Intended start of delivery 2021-12-22
2022/03/31	PCN(Product Change Notice)	Wire Bond Method/Material Change Description of change Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line New: ASE Kaohsiung back-end :- Gold wire bonding assembly line - New Copper Palladium added assembly line Intended start of delivery 2022-03-31
2022/05/08	PCN(Product Change Notice)	NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2022/05/08	PCN(Product Change Notice)	Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2023/08/28	PCN(Product Change Notice)	ASE Kaohsiung (Taiwan) - qualification of a second source substrate supplier (SCC - Shennan Circuit Company) for BGA package, size from BGA5x5 to BGA18x18, for listed products Old First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different impacted products. New First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product. Second source supplier SCC for all impacted products. Timing / schedule Intended start of delivery 2023-09-06
2024/10/09	PCN(Product Change Notice)	Description of change Old : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Timing / schedule Intended start of delivery 2024-12-16
2025/01/15	PCN(Product Change Notice)	Supplier Notice No.:PCI MDG/24/15095 Title: AMKOR ATP (Philippines) Enhanced traceability with 2D marking for UFBGA7x7 and UFBGA10x10 listed products ? (Addendum to PCN14374) Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change Intended start of delivery: 2025-01-15
2025/07/03	PCN(Product Change Notice)	PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3) old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
2025/11/07	PCN(Product Change Notice)	PCN No.: EMBEDDED PROCESSING/25/15422 Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package.
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PCN/PDN/NRND Information

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Products subject to notification

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Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
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