| 2023/02/22 |
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PCN(Product Change Notice)
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Symbolization update for select TSSOP devices |
| 2023/08/24 |
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PCN(Product Change Notice)
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Qualification of additional Fab sites (CFAB & DL-LIN) using qualified Process Technology and additional Assembly sites options for select devices |
| 2023/11/02 |
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PCN(Product Change Notice)
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Texas Instruments is pleased to announce the qualification of new assembly material for devices listed in “Product affected” section below. Devices will remain in current assembly facility and piece part changes as follows:
Group 1 device: Mold Compound 4205443 >> 4211649 Group 2 device: Mount Compound 4206201, 4042504 >> 4208458 Group 3 device: Mount Compound 4206201, 4042504 >> 4208458 Mold Compound 4205443 >> 4211649 |
| 2023/11/07 |
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PCN(Product Change Notice)
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Texas Instruments is pleased to announce the qualification of new assembly material for devices. Reason for Change:Continuity of supply. Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):None Proposed 1st Ship Date:Nov 07, 2023 |