Whiteboard Wednesdays - 3X Faster Design Closure with Quantus Integrated Virtual Metal Fill

In this week's Whiteboard Wednesdays video, Senior Product Engineering Manager Varun Raj Garapati outlines why traditional metal fill insertion, usually at the signoff stage, is not recommended for FinFET designs to ensure fastest design closure. The Quantus Integrated Virtual Metal Fill (IVMF) solution offers designers the ability to run virtual metal fill much earlier in the design during post-route optimization stage to reduce ECOs for faster design closure. IVMF functionality is available both in-design in the Innovus environment or as a standalone signoff version. To learn more about the Cadence Quantus Extraction Solution, visit https://www.cadence.com/go/quantus-ex.... Don’t Emulate—Virtualize Metal Fill! Find more great content from Cadence: Subscribe to our YouTube channel: https://www.youtube.com/channel/UC5qq... Connect with Cadence: Website: http://www.cadence.com Facebook: https://www.facebook.com/CadenceDesign LinkedIn: https://www.linkedin.com/company/cade... Twitter: https://twitter.com/Cadence About Cadence Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work, and play. Cadence software, hardware, and IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial, and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.

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