| 2024/06/10 |
|
PCN(Product Change Notice)
|
Microchip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products. |
| 2024/06/24 |
|
PCN(Product Change Notice)
|
Microchip has decided to not qualify Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx, ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages. |
| 2025/07/22 |
|
PCN(Product Change Notice)
|
PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 9/9th notification. |
| 2025/09/19 |
|
PCN(Product Change Notice)
|
PDN No.: NTDO-13QSSF734 Description: CCB 6186 Final Notice: Qualification of MP3A as an additional assembly site for ATtiny88, ATmega328P, ATtiny861A, ATmega168PA, ATtiny461A, ATtiny261A, ATtiny48, ATmega88PA, ATmega48PA, AT90PWM81, AT90PWM81EP and AT90PWM81OS device families available in 32L VQFN (5x5x0.9mm) package using CuPdAu bond wire material. |