| 2024/09/02 |
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PCN(Product Change Notice)
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Supplier Notice No.:24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change: Old/Marking composition with no 2D marking New/New marking composition with 2D marking for production assembly
Motivation: to enhance traceability
Intended start of delivery: 2024-09-02 |
| 2024/12/04 |
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PCN(Product Change Notice)
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Supplier Notice No.:MICROCONTROLLERS/24/15033 Title: JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change
Intended start of delivery: 2024-12-04
Intended start of delivery 2024-12-04 |
| 2024/12/04 |
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PCN(Product Change Notice)
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JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products |
| 2025/02/03 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN MDG/24/14976 Title: JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products
Description: Old/ Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New/ Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire Added Wire bonding material : - JSCC (China) Copper Palladium wire
Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function
Intended start of delivery: 2025-02-03 |
| 2025/04/15 |
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PCN(Product Change Notice)
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Supplier Notice No.:MICROCONTROLLERS/25/15166 Title: JSCC (China) - KOSTAT Carrier Tape & Cover Tape alternative packing material for TQFP7x7 & QFP10x10 package on listed products.
Description of change: Old/ For QFP7X7, QFP10X10 packages - E-PAK carrier tape and cover tape
New/ For QFP7X7 & QFP10X10 packages - E-PAK carrier tape and cover tape (until depletion of current material). - Then KOSTAT carrier tape (4-side partial fence) and cover tape.
Intended start of delivery: 2025-04-15 |
| 2025/05/20 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x Description of change
Old Current assembly sites (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. You may refer to 15271_Additional information.pdf document for further details.
New Current assembly sites: (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. Additional assembly site for extended capacity: - ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
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| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |
| 2025/07/18 |
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PCN(Product Change Notice)
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PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/09/02 |
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PCN(Product Change Notice)
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ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
Motivation: to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change
Intended start of delivery: 2025-09-02
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| 2025/12/15 |
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PCN(Product Change Notice)
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PCN No.:EMBEDDED PROCESSING/25/15423 Change Desc.:JSCC (China) additional source for legacy STM32F2x and STM32F4x listed products in LQFP 10x10 64L package
Intended start of delivery: 2025-12-15 |