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Mobile Phone teardown report:23013PC75G  Fomalhaut Techno Solutions  手机分解报告  -  商品詳細情報

Mobile Phone teardown report:23013PC75G

Fomalhaut Techno Solutions

手机分解报告

Mobile Phone teardown report:23013PC75G Fomalhaut Techno Solutions

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准确规格请浏览产品规格。

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Mobile Phone teardown report:23013PC75G

Mobile Phone teardown report:23013PC75G

Fomalhaut Techno Solutions

手机分解报告

Fomalhaut Techno Solutions

手机分解报告

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Specifications

Herstellername
Fomalhaut Techno Solutions
Produktname
Mobile Phone teardown report:23013PC75G
Produkt Klassifikation
手机分解报告
Model name
23013PC75G
Manufacturer
Xiaomi
Release date
2023/05/09
File size
7864KB
Feature
Snapdragon 8+ Gen 1と64MPメインカメラを搭載したゲーミングスマートフォン。

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