Mobile Phone teardown report:23013PC75G Fomalhaut Techno Solutions 手机分解报告 - 商品詳細情報
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Mobile Phone teardown report:23013PC75G
Mobile Phone teardown report:23013PC75G
Data sheet
Design/Simulation Data
Other Documents
Specifications
- Manufacturer name
- Fomalhaut Techno Solutions
- Product name
- Mobile Phone teardown report:23013PC75G
- Product classification
- 手机分解报告
- Model name
- 23013PC75G
- Manufacturer
- Xiaomi
- Release date
- 2023/05/09
- File size
- 7864KB
- Feature
- Snapdragon 8+ Gen 1と64MPメインカメラを搭載したゲーミングスマートフォン。
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