| 2021/07/08 |
|
PCN(Product Change Notice)
|
Amkor Philippines as an Alternate Site for TSSOP_4.4 At the additional factory, some packaging materials are different from the current factory. Assembly factory: Present: Carsem Malaysia (main factory) Future: Amkor Philippines (main factory), Carsem Malaysia Package material: Die Attach: Hysol QMI519 (current) => Abrestik 8290 (additional factory) MoldCompound: Sumitomo G700HA (current) => Sumitomo G700K (additional factory) |