| 2025/07/22 |
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PCN(Product Change Notice)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 6/9th notification. |
| 2025/08/22 |
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PCN(Product Change Notice)
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PDN No.: DSNO-03WOCU024 Description: CCB 7411 Final Notice: Qualification?of?palladium-coated copper with gold flash (CuPdAu) as a new bond wire material?for?selected ATXMEGA128xx, ATXMEGA192xx, ATXMEGA256xx, ATXMEGA32xx, ATXMEGA384xx, and ATXMEGA64xx device families available in 64L and 100L TQFP (14x14x1mm) packages at?the?MMT assembly?site. |
| 2025/08/22 |
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PCN(Product Change Notice)
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PDN No.: MAAN-18PQPC647 Description: CCB 7581.002 and 7581.003 Initial Notice: Qualification?of?ATP7 as an additional assembly?site?for?selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages. |