| 2022/05/22 |
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PCN(Product Change Notice)
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- Marking Standardization for Select Devices |
| 2022/07/08 |
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PCN(Product Change Notice)
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Qualification of new Fab site (RFAB) using qualified Process Technology, Die~Revision, and additional Assembly & BOM options for select devicess |
| 2022/09/27 |
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PCN(Product Change Notice)
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Texas Instruments is pleased to announce the qualification of a new fab & process technology (RFAB, LBC9) and Assembly & BOM option for selected devices as listed below in the product affected section. Construction differences are noted below: Current Fab Site: SFAB Process: HCMOS Wafer Diameter: 150mm Additional Fab Site: RFAB Process: LBC9 Wafer Diameter: 300mm Proposed 1st Ship Date: Sept 27, 2022 |
| 2024/12/11 |
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PCN(Product Change Notice)
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Supplier Notice No.:20240912000.1 Title: Qualification of additional Assembly sites for select TSSOP devices
Description of Change: Texas Instruments Incorporated is announcing the qualification of additional Assembly sites for devices listed below in the product affected section.
Reason for Change: Continuity of Supply
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None
Proposed 1st Ship Date: December 11, 2024 |