| 2020/11/20 |
|
PCN(Product Change Notice)
|
PRODUCT CHANGE NOTIFICATION REV 2: This interim update provides a partial listing of affected part numbers for which qualification is complete for the changes listed in the title of the tables below. Qualification / reliability reports are attached (embedded in this file). For other associated changes (identified in the Advance version (Rev 1) of PCN-2461 released May 8th, 2020) qualification testing is ongoing. Updates and qualification data will be provided in the Final version of this PCN. The Final version of this PCN is expected to be issued by January 31st, 2021, once all qualification has been completed.
|
| 2021/04/05 |
|
PCN(Product Change Notice)
|
REV 3: This update provides the final listing of affected part numbers for which qualification is complete for the changes |
| 2021/07/01 |
|
PCN(Product Change Notice)
|
Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| 2024/06/13 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:PCN-2660 REV 1 Title: Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products
DESCRIPTION OF CHANGE: Diodes Incorporated has qualified Diodes internal wafer fabrication source (GFAB) in Greenock, Scotland and Diodes internal wafer fabrication source (SFAB2) in Shanghai,China as additional wafer sources with wafer diameter being changed from 6 inch to 8 inch for select discrete products.
IMPACT: No change in datasheet parameters and product performance
Implementation Date: 13 June, 2024 |