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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2024/10/22	PCN(Product Change Notice)	Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site. Estimated First Ship Date:November 10, 2024 (date code: 2446)
2025/02/11	PCN(Product Change Notice)	Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages. Pre Change : Microchip Technology Tempe ? Fab 2 (TMGR) Post Change : Microchip Technology Gresham ? Fab 4 (GRTM) Estimated Qualification Completion Date: July 2025
2025/09/01	PCN(Product Change Notice)	PCN No. MAAN-13GMCS194 Change Desc. Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites. Estimated Qualification Completion Date: September 2025
2025/09/01	PCN(Product Change Notice)	PCN No. DSNO-07AOWZ935 Change Desc. Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites. Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material. Estimated Qualification Completion Date: September 2025
2025/09/23	PCN(Product Change Notice)	PDN No.: ALAN-23NWPP173 Description: CCB 7348.001 Final Notice: Qualification?of?palladium coated copper with gold flash (CuPdAu) as a new wire material?for?selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L?SOT-23 package at MTAI assembly?site.
2025/11/14	PCN(Product Change Notice)	PCN No.: ALAN-16SLVL366 Description: Final Notification : CCB 7364 Final Notice: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages. (cf. Interim Report : PP0000738356, PP0000738357, PP0000738358)
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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PCN/PDN/NRND Information

Product & Sales Information of products subject to notification