| 2023/12/11 |
|
PCN(Product Change Notice)
|
Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products Reason To ensure continuity of mold compound supply due to Kyocera KEG300 end of life and to further ensure our product performance with lead-free electroplating finish Description Assembly materials:Mold compound Old: Kyocera KEG300 New: Sumitomo EME-E500 Assembly materials:Lead finish (Tijuana only) Old: Tin dip finish New: Lead-free electroplating finish
Intended start of delivery 2024-02-29 |
| 2024/02/29 |
|
PCN(Product Change Notice)
|
Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products |
| 2024/09/26 |
|
PDN(Product Discontinuation Notice)
|
Supplier Notice No.:PD_349_24 Title: Product discontinuation
Reason: Products have reached end of life |
| 2025/06/10 |
|
PCN(Product Change Notice)
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PCN No.: 024/25X Description: Updated document, Reason of update:The INF N 024/25, dated 2025-06-04 has been~cancelled. |