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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2022/05/22 PCN(Product Change Notice) - Marking Standardization for Select Devices
2022/07/08 PCN(Product Change Notice) Qualification of new Fab site (RFAB) using qualified Process Technology, Die~Revision, and additional Assembly & BOM options for select devicess
2022/09/27 PCN(Product Change Notice) Texas Instruments is pleased to announce the qualification of a new fab & process technology
(RFAB, LBC9) and Assembly & BOM option for selected devices as listed below in the product affected section.
Construction differences are noted below:
Current Fab Site: SFAB
Process: HCMOS
Wafer Diameter: 150mm
Additional Fab Site: RFAB
Process: LBC9
Wafer Diameter: 300mm
Proposed 1st Ship Date: Sept 27, 2022
2024/12/11 PCN(Product Change Notice) Supplier Notice No.:20240912000.1
Title:
Qualification of additional Assembly sites for select TSSOP devices

Description of Change:
Texas Instruments Incorporated is announcing the qualification of additional Assembly sites for devices listed below in the product affected section.

Reason for Change:
Continuity of Supply

Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None

Proposed 1st Ship Date:
December 11, 2024
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PCN/PDN/NRND Information
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Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

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