| 2021/12/09 |
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PCN(Product Change Notice)
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A vulnerability of the RX65N has been reported whereby ID-protected on- chip flash memory contents can be read by means of a voltage fault injection attack. The attack requires physical access to the target device and modification of the circuit board to operate the outside of recommended conditions; specifically, removing any power pins capacitors on the PCBboard assembly, and performing targeted voltage glitches on the microcontroller VCLpin. This vulnerability is identified as CVE-2021-43327. |
| 2023/06/09 |
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PCN(Product Change Notice)
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Notice of material change for RX Family LFQFP/LQFP products Change the die bond and resin material. The changed material will be a material that has a proven track record in RSB assembly.
Estimated shipping date: 10/1/2023 |
| 2023/10/01 |
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PCN(Product Change Notice)
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Description of Change: Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd). The new materials are already proven and used for other products in RSB assembly. No samples planned because the changed materials are already well known and used in mass production for other products.
Schedules: Change Implementation: b/o Oct. 2023 onwards
# Due to the large number of products covered by this notice, we have divided the notices. |
| 2025/04/01 |
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PCN(Product Change Notice)
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Notice of Change of Lead Frame for RX100/200/600/700 Series LFQFP/ LQFP Package Products |