| 2022/10/07 |
|
PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 07-Oct-2022 |
| 2022/10/20 |
|
PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 20-Oct-2022 |
| 2022/10/20 |
|
PCN(Product Change Notice)
|
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
| 2022/10/20 |
|
PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 20-Oct-2022 (the earliest date that a customer could expect to receive changed material) |
| 2023/09/18 |
|
PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date:18-Sep-2023 (the earliest date that a customer could expect to receive changed material) |
| 2023/09/18 |
|
PCN(Product Change Notice)
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Description Of Change: Qualification of an alternate adhesive material and molding compound for select LFCSP packages (LFCSP with non-conductive epoxy). 1. Adhesive material: Hitachi EN4300 2. Mold compound: Sumitomo G700LA.
Effectivity Date: 18-Sep-2023 |